AMPAK AP6335
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AMPAK AP6335
Country of manuf.: China
Interface: SDIO (module)
SDIO 3.0
Connector: SD (solder down)
Form factor tags: module
ID: 02d0:4335
FCC ID: none available
WI1 chip1: Broadcom BCM4339
Probable Linux driver
brcmfmac (SDIO in backports)
(see also passys)
Antenna connector: U.FL
abgn+ac, 1x1:1
Flags: Bluetooth 4.0, FM radio
OUI: none specified
For a list of all currently documented Broadcom chipsets with specifications, see Broadcom.
802.11abgn/ac Wi-Fi + Bluetooth 4.0 (HS) + FM SDIO Module
- AMPAK AP6335 - SDIO 3.0 • Broadcom BCM4339
- • 2.4/5GHz Wi-Fi/BT 4.0 • 1T1R 802.11abgn/ac
- • SDIO 3.0 Wi-Fi, UART/PCM BT 4.0 + FM radio
