Manuf (OEM/ODM): Z-Com XG-702A
FCC approval date: 10 March 2004
Country of manuf.: Taiwan
Connector: Male A
Form factor tags: dongle
WI1 chip1: Intersil ISL3886
WI1 chip2: Intersil ISL3686B
For a list of all currently documented Intersil chipsets with specifications, see Intersil.
Device shares the same ID as the Z-Com XG-702A and is assumed to be the same.