D-Link DWL-900AP+ rev A, B
D-Link DWL-900AP+ A, B
Availability: common
FCC approval date: 16 August 2002
Type: access point
FCC ID: KA2DWL900AP-PLUS
Power: 5 VDC, 2 A
Connector type: barrel
CPU1: Samsung S3C4510B
FLA1: 1 MiB1,048,576 B <br />8,192 Kib <br />1,024 KiB <br />8 Mib <br />9.765625e-4 GiB <br /> (Macronix MX29LV800BTC-90)
RAM1: 8 MiB8,388,608 B <br />65,536 Kib <br />8,192 KiB <br />64 Mib <br />0.00781 GiB <br /> (Winbond W986432DH-5)
Expansion IFs: none specified
WI1 module: unknown
WI1 module IF: PCMCIA (16-bit)
WI1 chip1: Texas Instruments ACX100
WI1 chip2: RFMD Model?
WI1 802dot11 protocols: b
WI1 antenna connector: RP-SMA
ETH chip1: Samsung S3C4510B
ETH chip2: VIA VT6103
LAN speed: 100M
LAN ports: 1
b
| CPU1 brand | WI1 chip1 brand | WI1 chip2 brand | |
|---|---|---|---|
| D-Link DWL-900AP+ rev A, B | Samsung | Texas Instruments | RFMD |
| D-Link DWL-900AP+ rev C | Conexant | Texas Instruments | Maxim |
For a list of all currently documented Samsung chipsets with specifications, see Samsung.
For a list of all currently documented Texas Instruments (TI) chipsets with specifications, see Texas Instruments.
OEM Global Sun GL2422AP-0T4
see Hacking the DWL-900AP+ (via archive.org) and the DWL-900AP+ page on Seattle Wireless
It appears the FCC ID some units (perhaps all or most A revision units, at least A2) is O7J-GL242204-0T.
CPU is part S3C4510B01-QERO.
