D-Link DWL-900AP+ rev C
D-Link DWL-900AP+ C
FCC approval date: 14 March 2003
Type: access point
FCC ID: KA2ACX100, O7J-GL2422MP-MT
Power: 5 VDC, 2 A
Connector type: barrel
CPU1: Conexant CX82100
FLA1: 1 MiB1,048,576 B <br />8,192 Kib <br />1,024 KiB <br />8 Mib <br />9.765625e-4 GiB <br /> (STMicroelectronics M29W800DB)
RAM1: 8 MiB8,388,608 B <br />65,536 Kib <br />8,192 KiB <br />64 Mib <br />0.00781 GiB <br /> (ICSI IC42S16400-7T)
Expansion IFs: none specified
WI1 module: Global Sun GL2422MP-MT
WI1 module IF: Mini PCI
WI1 chip1: Texas Instruments ACX100
WI1 chip2: Maxim MAX2820
WI1 802dot11 protocols: b
WI1 antenna connector: RP-SMA
ETH chip1: Conexant CX82100
ETH chip2: VIA Model?
LAN speed: 100M
LAN ports: 1
b
802dot11 OUI: none specified
| FCC ID | |
|---|---|
| D-Link DI-614+ rev B1 | KA2ACX100 O7J-GL2422MP-MT |
| D-Link DI-614+ rev B2 | KA2ACX100 |
| D-Link DWL-520+ rev B1 | KA2ACX100 O7J-GL2422MP-MT |
| FCC ID | |
|---|---|
| D-Link DI-614+ rev B1 | KA2ACX100 O7J-GL2422MP-MT |
| D-Link DWL-520+ rev B1 | KA2ACX100 O7J-GL2422MP-MT |
| Global Sun GL2422MP-MT | O7J-GL2422MP-MT |
| CPU1 brand | WI1 chip1 brand | WI1 chip2 brand | |
|---|---|---|---|
| D-Link DWL-900AP+ rev A, B | Samsung | Texas Instruments | RFMD |
| D-Link DWL-900AP+ rev C | Conexant | Texas Instruments | Maxim |
For a list of all currently documented Conexant chipsets with specifications, see Conexant.
For a list of all currently documented Texas Instruments (TI) chipsets with specifications, see Texas Instruments.
OEM Global Sun GL2422AP-1T1 (GL2422AP-1T1-B10)
see the DWL-900AP+ page on Seattle Wireless
D-link DWL-900AP+ Hardware Overview
