Murata PAC-USWHS002-WF-2

Murata PAC-USWHS002-WF -2

FCC approval date: 14 June 2018

Type: module, IoT

FCC ID: 2AIGCWFB003

Power: ? VDC, ? A

CPU1: STMicroelectronics STM32F413 (100 MHz)
FLA1: 4 MiB4,194,304 B <br />32,768 Kib <br />4,096 KiB <br />32 Mib <br />0.00391 GiB <br /> (Winbond W25Q32JVZPIQ)
RAM1: ? MiB (Brand? Model?)

Expansion IFs: none specified

WI1 chip1: Murata SS7411014
WI1 802dot11 protocols: bgn
WI1 MIMO config: 1x1:1
WI1 antenna connector: none

bgn

Flags: Bluetooth LE

802dot11 OUI: 00:AE:FA, DC:EF:CA

For a list of all currently documented Murata chipsets with specifications, see Murata.
For a list of all currently documented STMicro chipsets with specifications, see STMicro.

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Product Description from the Test Report filed with the FCC:

"The PAC-USWHS002-WF-2 WIFI-BLE adapter is the second generation in its series. It wirelessly monitors and controls a MEUS [Mitsubishi Electric United States] HVAC unit via WIFI link. This device communicates wirelessly using either 802.11b/g/n WIFI mode or Bluetooth Smart (i.e. BLE) mode"

"MURATA 801120 REV B COPYRIGHT 2017" is silkscreened on the board in the FCC photos.

Top-side marking for the Winbond W25Q32JVZPIQ is 25Q32JVIQ.