SparkLAN AP6256

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SparkLAN AP6256
Availability: Currently Shipping

(Est.) release date: February 2020
(Est.) initial retail price (in USD): $30

Amazon image

ASIN
B084QB6FM4 (Flag of the United States.svg, On Amazon, On CCC)

Interface: SDIO

SDIO 3.0
Connector: SD (solder down)
Form factor tags: module (SiP)

FCC ID: H8N-AP6256

WI1 chip1: Broadcom BCM43456

Probable Linux driver
unknown
(see also passys)

Antenna connector: none

abgn+ac, 1x1:1

Flags: Wi-Fi 5, 256QAM, Bluetooth 5

OUI: none specified

 FCC ID
Radxa Rock Pi 4B+ (4GB)H8N-AP6256
2A3PA-ROCKPI4

For a list of all currently documented Broadcom chipsets with specifications, see Broadcom.


802.11ac 1x1 WiFi with Bluetooth 5.0 Combo SiP Module

Product page

Product Key Features

  • Chipset: Broadcom BCM43456
  • Supports 1×1 802.11a/b/g/n/ac WLAN standards
  • Single-die WLAN and Bluetooth combination solution
  • Single-stream spatial multiplexing up to 433.3 Mbps data rate
  • Supports 20 at 2.4GHz and 20/40/80MHz at 5GHz
with optional SGI (256QAM modulation)
  • Supports Bluetooth 5.0
  • Frequency Range: 2.400~2.4835 GHz, 5.150~5.850 GHz
  • Interface: WLAN: SDIO 3.0/2.0, Bluetooth: UART/PCM
  • Form Factor: SiP Stamp Type, Dimensions: 12×12×1.65 mm

Models

SparkLANSiP Module SeriesWi-Fi Module List (2018)

See also

AMPAKBroadcomQualcomm Atheros (QCA)
802.11bgn Wi-Fi SiP Module • Spec. on EW
802.11bgn Wi-Fi + Bluetooth 4.1 (M.2 LGA Type 1216) Module • EW
802.11abgn/ac Wi-Fi + Bluetooth 5.0 Combo SiP Module • EW
802.11abgn/ac/ax Wi-Fi + Bluetooth 5.0 Combo SiP Module
WLAN: SDIO / SPI / HSIC; Bluetooth / FM: UART • EW
802.11abgn/ac Wi-Fi + Bluetooth 5.0 (M.2 LGA Type 1216) Module • EW
802.11abgn/ac Wi-Fi + Bluetooth 4.1 (M.2 LGA Type 1216) Module
FCC ID: H8N-AP6356S (2019-09-04) • Askey
WLAN: PCIe for Wi-Fi, UART/USB/PCM interface for Bluetooth • EW
802.11abgn/ac Wi-Fi + Bluetooth 5.0 Combo SiP Module • EW
802.11bgn Wi-Fi + Bluetooth 4.1 (M.2 LGA Type 1216) Module • EW