AMPAK AP6212A
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AMPAK AP6212 A
Availability: now
FCC approval date: 26 July 2017
Country of manuf.: China
Interface: SDIO (module)
SDIO 2.0
Connector: SD (solder down)
Form factor tags: module
ID: 02d0:????
FCC ID: ZQ6-AP6212A
WI1 chip1: Broadcom BCM43438
Probable Linux driver
unknown
(see also passys)
Antenna connector: U.FL
bgn, 1x1:1
Flags: Bluetooth 4.1
has accessible UART
OUI: none specified
| Chip1 brand | Chip2 brand | |
|---|---|---|
| AMPAK AP6212 | Broadcom | |
| AMPAK AP6212A | Broadcom |
For a list of all currently documented Broadcom chipsets with specifications, see Broadcom.
802.11bgn WLAN/BT Combo Module
- WICED 1T1R 802.11bgn (150Mbps)
See also
- AMPAK AP6181 - SDIO (02d0:a962) BCM43362 (WiFi) (1T1R 802.11bgn)
- AMPAK AP6210 - SDIO (02d0:a962) BCM43362 (WiFi)/BCM20710 (BT 4.0)
- AMPAK AP6212 - SDIO (02d0:a9a6) BCM43430 (WiFi/BT 4.0) (1T1R 802.11bgn)
- AMPAK AP6212A - SDIO (02d0:a9a6) BCM43438 (WiFi/BT 4.0) • ZQ6-AP6212A
- AMPAK AP6234A - SDIO (02d0:a94c) BCM43340 (WiFi/BT 4.0) (1T1R 802.11abgn)
- AMPAK AP6255 - SDIO (02d0:a9bf) BCM43455 (802.11abgn/ac) (BT 4.2)
- AMPAK AP6330 - SDIO (02d0:4330) BCM4330 (WiFi)/BCM40183 (BT 4.0 + HS)
