FCC approval date: 28 January 2013
Country of manuf.: China
Power: 12 VDC, 1 A
Connector type: barrel
CPU1: Broadcom BCM5354
FLA1: 32 MiB33,554,432 B <br />262,144 Kib <br />32,768 KiB <br />256 Mib <br />0.0313 GiB <br /> (Macronix Model?)
RAM1: ? MiB (ESMT M13S2561616A-5T)
Expansion IFs: USB 2.0
USB ports: 1
WI1 chip1: Broadcom BCM5354
WI1 802dot11 protocols: bg
WI1 antenna connector: RP-SMA
ETH chip1: Brand? Model?
LAN speed: 100M
LAN ports: 1
WAN speed: 100M
WAN ports: 1
802dot11 OUI: none specified
For a list of all currently documented Broadcom chipsets with specifications, see Broadcom.
"MB7900 REVA" and "Top Global 20090217" is silkscreened on the board in the FCC photos.
There is a Mini PCIe slot (presumably USB only) shown in the FCC photos to be used with a 3G module (which is not pictured).
The Flash chip shown in the FCC photos is a Macronix MX29GL256.
Default credentials are from the FCC manual.