SendFar SF-3000

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SendFar SF-300 0 (X-0.20)
Availability: EoL

FCC approval date: 18 November 2003
Country of manuf.: Taiwan

Type: bridge

Power: 24 VDC, 0.83 A
Connector type: Ethernet (PoE)
PoE tag: non-standard

CPU1: Samsung S3C4510B
FLA1: 2 MiB2,097,152 B <br />16,384 Kib <br />2,048 KiB <br />16 Mib <br />0.00195 GiB <br /> (Toshiba TC58FVT160AFT-70)
RAM1: 8 MiB8,388,608 B <br />65,536 Kib <br />8,192 KiB <br />64 Mib <br />0.00781 GiB <br /> (ISSI IS42S16400-7T)

Expansion IFs: PCMCIA (16-bit)
PCMCIA slots: 1
Serial: yes, DE-9

WI1 module: Senao SL-2511CD PLUS EXT2
WI1 module IF: PCMCIA (16-bit)
WI1 chip1: Intersil ISL3873B
WI1 chip2: Intersil ISL3685
WI1 802dot11 protocols: b
WI1 antenna connector: MMCX, RP-SMA

ETH chip1: Samsung S3C4510B
ETH chip2: VIA VT6103
LAN speed: 10M
LAN ports: 1

b

802dot11 OUI: 00:02:6F (27 E, 63 W)

 FCC ID
D-Link DWL-1750NI3-2511CD-PLUS3
Junxion Box (JB-110b)NI3-2511CD-PLUS3
Senao SL-2511AP1 PLUSNI3-2511SR
NI3-2511CD-PLUS3
Senao SL-2511AP2 PLUSNI3-2511AP2PLUS
NI3-2511CD-PLUS3
Senao SL-2511BG PLUSNI3-2511BGPLUS
NI3-2511CD-PLUS3
Senao SL-2511BG2 PLUSNI3-2511BG2PLUS
NI3-2511CD-PLUS3
Senao SL-2511CD PLUS EXT2NI3-2511CD-PLUS3
Senao SL-2511SRNI3-2511SR
NI3-2511CD-PLUS3
SendFar SF-300QA5-HAB-03002
NI3-2511CD-PLUS3
 CPU1 brandWI1 chip1 brandWI1 chip2 brand
SendFar SF-300SamsungIntersilIntersil
SendFar SF-3000SamsungIntersilIntersil

For a list of all currently documented Intersil chipsets with specifications, see Intersil.
For a list of all currently documented Samsung chipsets with specifications, see Samsung.


Wireless Access Bridge


See also