HP BOISB-0410-00
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HP BOISB-0410-00
Manuf (OEM/ODM): Z-Com
FCC approval date: 25 January 2005
Country of manuf.: China
Interface: SPI (module)
Form factor tags: module
FCC ID: B94BOISB0410
IC ID: 466F-BOISB410
WI1 chip1: Marvell 88W8385
WI1 chip2: Marvell 88W8010
Antenna connector: none
bg
OUI: none specified
For a list of all currently documented Marvell chipsets with specifications, see Marvell.
Firenze Wireless Radio Module
"SPI Module V04" is silkscreened on the board in the FCC photos.
Per the FCC label, Z-Com appears to be the manufacturer.
This module appears to be used in the HP LaserJet 1022nw.
Specifications
Additional specifications, per HP's FCC manual / datasheet...
Typical Receiver Sensitivity w/ 11b rates (PER = 0.08) (more)
- -80 dBm @ 11M
Typical Receiver Sensitivity w/ 11g rates (PER = 0.10) (more)
- -86 dBm @ 6M (BPSK)
- -85 dBm @ 9M (BPSK)
- -83 dBm @ 12M (QPSK)
- -81 dBm @ 18M (QPSK)
- -78 dBm @ 24M (16-QAM)
- -74 dBm @ 36M (16-QAM)
- -70 dBm @ 48M (64-QAM)
- -69 dBm @ 54M (64-QAM)